Electronic device including antenna

ABSTRACT

An electronic device includes a housing including a first plate including a glass plate, a second plate facing the first plate, and a side surface surrounding a space between the first plate and the second plate, a display positioned inside the space and exposed through a first area of the first plate, an antenna structure at least partially overlapping a second area of the first plate when viewed from above the first plate and which is connected to the second area, and a processor.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. application Ser. No.16/296,701, filed Mar. 8, 2019, which claims priority to KR10-2018-0028195, filed Mar. 9, 2018, the entire contents of which areall hereby incorporated herein by reference in their entireties.

BACKGROUND 1. Field

The present disclosure relates to a technology for mounting antennas andparts in an electronic device.

2. Description of Related Art

As an information technology (IT) develops, various types of electronicdevices are widely being supplied. An electronic device may communicatewith any other electronic device or a base station by using an antenna.

Nowadays, as the network traffic of a mobile device sharply increases,next-generation mobile communication technology using a signal in aultra-high-frequency band, for example, 5th generation (5G) technologyis being developed. If the signal in the ultra-high-frequency band isused, a wavelength of the signal may become short to a millimeter unit.Also, since the bandwidth may be used more widely, a significant amountof information may be transmitted or received. Since an antenna arrayhas an effective isotropically radiated power (EIRP) greater than oneantenna, the antenna array may transmit or receive various kinds of datamore effectively. The signal in the ultra-high-frequency band may bereferred to as a “millimeter wave signal”.

An electronic device may be equipped with other parts in addition to theantenna structure. For example, the electronic device may be equippedwith cover glass, a display, a printed circuit board, or a rear cover.As the various parts are mounted on an electronic device, the electronicdevice may lack the space in which the antenna structure is capable ofbeing disposed.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present disclosure.

SUMMARY

According to an embodiment of the present disclosure, at least one ofthe antenna structure and other parts may be disposed in the partialarea of a display of the electronic device.

In accordance with an aspect of the present disclosure, an electronicdevice may include a housing including a first plate including a glassplate, a second plate facing the first plate, and a side surfacesurrounding a space between the first plate and the second plate, adisplay disposed inside the space and exposed through a first area ofthe first plate, an antenna structure comprising an antenna at leastpartly overlapping a second area of the first plate when viewed fromabove the first plate and being connected to the second area, a printedcircuit board disposed in parallel to the first plate inside the spaceand electrically connected to a wireless communication circuit, and aprocessor disposed on the printed circuit board and connected to thedisplay. The antenna structure may include a first structure including afirst surface facing the side surface and a second surface facing awayfrom the side surface, a first array of conductive patterns formed onthe first surface or between the first surface and the second surface,wherein the wireless communication circuit, which is attached to theantenna structure or formed on the antenna structure, which iselectrically connected to the first array, and which is configured totransmit and/or receive a signal in a frequency range of 3 GHz to 100GHz.

In accordance with another aspect of the present disclosure, anelectronic device may include a housing including a first plateincluding a first area and a second area surrounding the first area, asecond plate facing the first plate, a side surface surrounding a spacebetween the first plate and the second plate, a display disposed insidethe space and exposed through the first area, an antenna structuredisposed at a location corresponding to the second area in the space, asecond printed circuit board disposed between the display and the secondplate, and a processor disposed on the second printed circuit board andelectrically connected to a wireless communication circuit. The antennastructure may include a first printed circuit board attached to thesecond area, a first antenna array disposed in an area adjacent to thesecond area in the first printed circuit board, wherein the wirelesscommunication circuit configured to transmit and/or receive a signal ina specified frequency band by feeding power to the first antenna array.

According to various embodiments of the present disclosure, at least oneof an antenna structure and other parts may be disposed in a displaydeactivation area of an electronic device, thereby improving the spaceutilization of the electronic device.

A variety of effects directly or indirectly understood through thisdisclosure may be provided.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is an exploded perspective view illustrating an exampleelectronic device, according to an embodiment;

FIG. 2A is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according toan embodiment;

FIG. 2B diagram illustrating an example antenna structure including afirst antenna array and a second antenna array, according to anembodiment;

FIG. 2C is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according toanother embodiment;

FIG. 2D is a diagram illustrating an example antenna structure includinga first antenna array and a second antenna array, according to anotherembodiment;

FIG. 2E is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according tostill another embodiment;

FIG. 2F is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according tostill another embodiment;

FIG. 3A is a sectional view illustrating an example antenna structureincluding an antenna array, according to an embodiment;

FIG. 3B is a diagram illustrating an example antenna structure includingan antenna array, according to an embodiment;

FIG. 3C is a sectional view illustrating an example antenna structureincluding an antenna array, according to another embodiment;

FIG. 3D is a sectional view illustrating an example antenna structureincluding an antenna array, according to still another embodiment;

FIG. 3E is a sectional view illustrating an example antenna structureincluding an antenna array, according to still another embodiment;

FIG. 4A is a sectional view illustrating an example antenna structureincluding an antenna array, according to an embodiment;

FIG. 4B a diagram illustrating an example antenna structure including anantenna array, according to an embodiment;

FIG. 4C is a sectional view illustrating an example antenna structureincluding an antenna array, according to another embodiment;

FIG. 5 is a sectional view illustrating an example electronic device inwhich an embossing layer is interposed between an antenna structure anda cover glass, according to an embodiment;

FIG. 6A is a sectional view illustrating an example inverted L-shapedantenna structure, according to an embodiment;

FIG. 6B is a diagram illustrating an example inverted L-shaped antennastructure, according to an embodiment;

FIG. 6C is a sectional view illustrating an example inverted L-shapedantenna structure, according to another embodiment;

FIG. 6D is a sectional view illustrating an example inverted L-shapedantenna structure, according to still another embodiment;

FIG. 6E is a sectional view illustrating an example inverted L-shapedantenna structure, according to yet another embodiment;

FIG. 7A is a sectional view illustrating an example U-shaped antennastructure, according to an embodiment;

FIG. 7B is a sectional view illustrating an example U-shaped antennastructure, according to another embodiment;

FIG. 8A is a diagram illustrating an example antenna structure includingone wireless communication circuit, according to an embodiment;

FIG. 8B is a diagram illustrating an example antenna structure includingtwo wireless communication circuits, according to an embodiment;

FIG. 8C is a diagram illustrating an example antenna structure includingthree wireless communication circuits, according to an embodiment;

FIG. 9A is a sectional view illustrating an example electronic deviceincluding an electronic part interposed between an antenna structure anda display, according to an embodiment;

FIG. 9B is a diagram illustrating an example antenna structure and anelectronic part, according to an embodiment;

FIG. 10A is a sectional view illustrating an example electronic devicein which a first printed circuit board and a second printed circuitboard are connected to each other, according to an embodiment;

FIG. 10B is a sectional view illustrating an example electronic devicein which a first printed circuit board and a second printed circuitboard are connected to each other, according to another embodiment;

FIG. 10C is a sectional view illustrating an example electronic devicein which a first printed circuit board and a second printed circuitboard are connected to each other, according to still anotherembodiment;

FIG. 11A is a sectional view illustrating an example I-shaped antennastructure, according to an embodiment;

FIG. 11B is a sectional view illustrating an example L-shaped antennastructure, according to an embodiment;

FIG. 11C is a sectional view illustrating an example L-shaped antennastructure, according to another embodiment;

FIG. 12A is a diagram illustrating an example electronic device in whichan antenna structure including a plurality of electronic parts ismounted, according to an embodiment;

FIG. 12B is a diagram illustrating an enlarged view of an exampleantenna structure, according to an embodiment;

FIG. 12C is a diagram illustrating an enlarged view of an exampleantenna structure, according to another embodiment;

FIG. 13 is a block diagram illustrating an example electronic device ina network environment, according to various embodiments;

FIG. 14 is a block diagram illustrating an example of an electronicdevice supporting 5G communication; and

FIG. 15 is a block diagram illustrating an example communication device,according to an embodiment.

DETAILED DESCRIPTION

FIG. 1 is an exploded perspective view illustrating an exampleelectronic device, according to an embodiment.

Referring to FIG. 1 , an electronic device 100 may include housing 110,a display 120, a first antenna structure 130 f, a second antennastructure 130 s, a shield layer 140, a printed circuit board 150, and aprocessor 160. According to an embodiment, the electronic device 100 maybe implemented without some of the components illustrated in FIG. 1 ormay be implemented to further include one or more components notillustrated in FIG. 1 . Also, the order in which the components includedin the electronic device 100 are stacked may be different from thestacked order illustrated in FIG. 1 .

The housing 110 may form an outer appearance of the electronic device100. For example, the housing 110 may include a first plate 111, asecond plate 113 facing the first plate 111, and a side member (e.g.,including a side face) 112 surrounding the space between the first plate111 and the second plate 113.

The first plate 111 may protect various components (e.g., the display120) included in the electronic device 100 from an external impact. Forexample, the first plate 111 may include a transparent material, suchas, for example, and without limitation, tempered glass, reinforcedplastics, a flexible polymer material, or the like. According to anembodiment, the first plate 111 may be referred to as “cover glass”.

According to an embodiment, the first plate 111 may include a first area111 f, a second area 111 s, or a third area lilt. The first area 111 fmay transmit light generated by the display 120. The second area 111 sor the third area 111 t may surround or be adjacent to the first area111 f, and various sensors (e.g., an illuminance sensor and a camera)may be exposed through the second area 111 s or the third area lilt. Inthis disclosure, the second area 111 s and/or the third area 111 t maybe referred to as a “bezel area”.

The side member (e.g., including a side surface) 112 may form an outerappearance of a side surface of the electronic device 100. Furthermore,various components included in the electronic device 100 may be mountedin the side member 112.

The second plate 113 may be coupled in the direction ‘-z’ of the sidemember 112. The second plate 113 may include, for example, and withoutlimitation, tempered glass, plastic, and/or metal, or the like.According to an embodiment, the second plate 113 may be integrallyimplemented with the side member 112 or may be implemented to beremovable by a user.

The first antenna structure 130 f and the second antenna structure 130 smay be disposed in the direction ‘-z’ of the second area 111 s or thethird area lilt, respectively. For example, the first antenna structure130 f may be disposed in the direction ‘-z’ of the second area 111 s,and the second antenna structure 130 s may be disposed in the direction‘-z’ of the third area 111 t.

According to an embodiment, the first antenna structure 130 f maytransmit and/or receive a signal in a specified frequency band (e.g., 3GHz to 100 GHz). Moreover, the first antenna structure 130 f maytransmit and/or receive a signal in the direction ‘z’, direction ‘-z’,and/or direction ‘-y’.

In the electronic device 100 according to an embodiment of the presentdisclosure, since the first antenna structure 130 f is disposed in thesecond area 111 s, or the third area lilt, the thickness of theelectronic device 100 may be reduced. Also, since the first antennastructure 130 f is disposed in the second area 111 s or the third area111 t, the electronic device 100 may transmit and/or receive a signal inthe direction ‘z’. In the present disclosure, the description given withregard to the first antenna structure 130 f may also be applied to thesecond antenna structure 130 s.

The display 120 may be disposed in the direction ‘-z’ of the first area111 f. The display 120 may be electrically connected with the printedcircuit board 150, and may output content (e.g., a text, an image, avideo, an icon, a widget, or a symbol) and/or may receive a touch input(e.g., a touch, a gesture, or a hovering) from the user.

The shield layer 140 may be interposed between the display 120 and theside member 112. The shield layer 140 may, for example, shield anelectro-magnetic wave generated between the display 120 and the printedcircuit board 150 to prevent and/or reduce an electro-magneticinterference between the display 120 and the printed circuit board 150.

Various types of electronic parts, elements, and/or printed circuits ofthe electronic device 100 may be mounted on the printed circuit board150 or a second printed circuit board. For example, and withoutlimitation, an application processor (AP), a communication processor(CP), and/or a memory may be mounted on the printed circuit board 150.In this disclosure, the printed circuit board 150 may be referred to asa “main board” or a “printed board assembly (PBA)”.

The processor 160 may be electrically connected to the first antennastructure 130 f and the second antenna structure 130 s. The processor160 may transmit and/or receive a signal in a specified frequency band(e.g., 3 GHz to 100 GHz) by feeding power to the first antenna structure130 f and the second antenna structure 130 s. For example, the signalemitted from the first antenna structure 130 f and the second antennastructure 130 s may be radiated in the direction ‘z’, direction ‘−z’,direction ‘y’, and/or direction ‘−y’. In the present disclosure, theprocessor 160 may be referred to, for example, and without limitation,as a “communication processor (CP)”.

In the present disclosure, the description given with reference to FIG.1 may be identically applied to components having the same referencenumerals/marks as the components of the electronic device 100 describedwith reference to FIG. 1 . Moreover, in the present disclosure, thedirection ‘y’ may refer, for example, the direction in which the secondantenna structure 130 s is positioned with respect to the first antennastructure 130 f; the direction ‘z’ may refer, for example, to thedirection in which the first plate 111 is positioned with respect to thefirst antenna structure 130 f; the direction ‘x’ may refer, for example,to the direction perpendicular to each of the direction ‘y’ and thedirection ‘z’.

FIG. 2A is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according toan embodiment. FIG. 2B is a diagram illustrating an example antennastructure including a first antenna array and a second antenna array,according to an embodiment. FIG. 2B illustrates a detailed structuralview of an antenna structure 220 illustrated in FIG. 2A.

FIG. 2C is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according toanother embodiment. FIG. 2D is a diagram illustrating an example antennastructure including a first antenna array and a second antenna array,according to another embodiment. FIG. 2D illustrates a detailedstructural view of an antenna structure 230 illustrated in FIG. 2C.

FIG. 2E is a sectional view illustrating an example antenna structureincluding a first antenna array and a second antenna array, according tostill another embodiment. FIG. 2F is a sectional view illustrating anexample antenna structure including a first antenna array and a secondantenna array, according to still another embodiment.

Referring to FIG. 2A, the antenna structure 220 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) may beattached to the second area 111 s. For example, an adhesive member 210may be disposed between the antenna structure 220 and the second area111 s, and the antenna structure 220 may be attached to the second area111 s through the adhesive member 210. When the antenna structure 220 isattached to the second area 111 s, the antenna structure 220 ispositioned on substantially the same plane as some areas (e.g., anembossing layer 141, a copper sheet 143, and a heat sink sheet 144) ofthe display 120.

According to an embodiment, an empty space 230 h may be formed betweenthe antenna structure 220 and the display 120, and various electronicparts (e.g., a fingerprint sensor or an illuminance sensor) may bedisposed in the empty space 230 h. The description about the empty space230 h illustrated in FIG. 2A may be applied to various embodiments to bedescribed below.

According to an embodiment, the antenna structure 220 may include aprinted circuit board 221 (or a first printed circuit board), a firstantenna array 222, and/or a second antenna array 223. According to anembodiment, a communication circuit (not illustrated) may be disposed inthe antenna structure 220. For example, the first antenna array 222 orthe second antenna array 223 may include, for example, and withoutlimitation, at least one of a patch antenna array, a dipole antennaarray, or the like.

In the present disclosure, the printed circuit board (e.g., the printedcircuit board 221) included in the antenna structure (e.g., the firstantenna structure 130 f or the second antenna structure 130 s of FIG. 1) may be referred to as a “first printed circuit board”, and the printedcircuit board 150 interposed between the display 120 and the secondplate 113 may be referred to as a “second printed circuit board”.

In the case of FIG. 2A, the antenna structure 220 may include the firstantenna array 222 and the second antenna array 223. For example, thefirst antenna array 222 may include a dipole antenna. For anotherexample, the second antenna array 223 may include a patch antenna. Thefirst antenna array 222 may face in the direction ‘z’, and the secondantenna array 223 may face in the direction ‘−y’. The first antennaarray 222 may transmit and/or receive a signal in the direction ‘z’ andthe direction ‘−y’. The second antenna array 223 may transmit and/orreceive a signal in the direction ‘−y’.

According to an embodiment, the display 120 may include a display panel120 p, the embossing layer 141, the copper sheet 143, and the heat sinksheet 144.

According to an embodiment, a plurality of pixels and a plurality ofwires for applying power to the pixels may be mounted in the displaypanel 120 p. The embossing layer 141 may protect other parts from impactby absorbing the impact applied to the electronic device 100. The coppersheet 143 may shield electromagnetic waves generated between the display120 and the printed circuit board 150. The heat sink sheet 144 maydisperse heat generated from the display 120. Although not illustratedin FIG. 2A, the display 120 may further include a digitizer that sensesthe location of the user input based on the electromagnetic field thatchanges in the first area 111 f.

According to an embodiment, the first antenna array 222 may include aplurality of dipole antennas arranged in the direction ‘x’ or thedirection ‘−x’ when viewed from above the cover glass 111. Furthermore,the second antenna array 223 may include a plurality of patch antennasarranged in the direction ‘x’ or the direction ‘−x’ when viewed fromabove the cover glass 111.

Referring to FIG. 2B, the first antenna array 222 may include multipledipole antennas. The first antenna array 222 may be connected to awireless communication circuit 226 via a feed line 224. The wirelesscommunication circuit 226 may feed power to the first antenna array 222through the feed line 224. When the wireless communication circuit 226feeds power to the first antenna array 222, the first antenna array 222may form beams in orthogonal directions. The signaltransmission/reception rate of the antenna structure 220 may be improvedas the first antenna array 222 forms beams in orthogonal directions.

According to an embodiment, the second antenna array 223 may be disposedon one surface of the printed circuit board 221. For example, the secondantenna array 223 may include patch antennas. The wireless communicationcircuit 226 may directly feed power to the second antenna array 223 viathe feed line 224, or may indirectly feed power to the second antennaarray 223. When feeding power to the second antenna array 223, thewireless communication circuit 226 may transmit and/or receive thesignal in a specified frequency band via the second antenna array 223.

According to an embodiment, a via 225 may be formed on the printedcircuit board 221. The via 225 may improve isolation between the firstantenna array 222 and the second antenna array 223.

Referring to FIG. 2C, the antenna structure 230 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 231 and a second antenna array 232. Forexample, the first antenna array 231 may include dipole antennas. Thesecond antenna array 232 may include patch antennas. The first antennaarray 231 and the second antenna array 232 may be disposed such thatbeams are formed in the direction ‘−y’. For example, the first antennaarray 231 may transmit and/or receive a signal in the direction ‘−y’.The second antenna array 232 may transmit and/or receive a signal in thedirection ‘−y’.

When the antenna structure 220 illustrated in FIG. 2A is compared withthe antenna structure 230 illustrated in FIG. 2C, the directions thebeams formed by the first antenna array 222 of FIG. 2A and the firstantenna array 231 of FIG. 2C may be different from each other. Since thefirst antenna array 222 of FIG. 2A forms a beam in the direction ‘z’,the intensity of the signal radiated in the direction ‘z’ may bestronger than the intensity of the signal radiated in the direction‘−y’. Since the first antenna array 231 of FIG. 2C forms a beam in thedirection ‘−y’, the intensity of the signal radiated in the direction‘−y’ may be stronger than the intensity of the signal radiated in thedirection ‘z’.

Referring to FIG. 2D, the antenna structure 230 may use a first via 231v as the first antenna array 231. For example, a wireless communicationcircuit 235 and the first via 231 v may be electrically connected toeach other through a feed line 233. The wireless communication circuit235 may feed power to the first via 231 v through the feed line 233directly or indirectly. The first via 231 v may transmit and/or receivea signal in a specified frequency band.

According to an embodiment, the second antenna array 232 may be disposedon one surface of the printed circuit board 221. The wirelesscommunication circuit 235 may directly feed power to the second antennaarray 232 via the feed line 233, or may indirectly feed power to thesecond antenna array 223.

According to an embodiment, a second via 234 may be formed on theprinted circuit board 221. The second via 234 may improve isolationbetween the first antenna array 231 and the second antenna array 232.

Referring to FIG. 2E, an antenna structure 240 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 241, a second antenna array 242, a thirdantenna array 243, and a fourth antenna array 244. For example, each ofthe first antenna array 241 and the second antenna array 242 may includedipole antennas, and each of the third antenna array 243 and the fourthantenna array 244 may include patch antennas.

According to an embodiment, the first antenna array 241 and the secondantenna array 242 may be disposed to form beams in the direction ‘z’ andthe direction ‘−z’, respectively. The third antenna array 243 and thefourth antenna array 244 may be disposed to form beams in the direction‘−y’, respectively. For example, the first antenna array 241 maytransmit and/or receive a signal in the direction ‘z’. For example, thesecond antenna array 242 may transmit and/or receive a signal in thedirection ‘−z’. For example, the third antenna array 243 and fourthantenna array 244 may transmit and/or receive a signal in the direction‘−y’.

Referring to FIG. 2F, an antenna structure 250 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 251, a second antenna array 252, a thirdantenna array 253, and a fourth antenna array 254. For example, each ofthe first antenna array 251 and the second antenna array 252 may includedipole antennas, and each of the third antenna array 253 and the fourthantenna array 254 may include patch antennas. The first antenna array251, the second antenna array 252, the third antenna array 253, and thefourth antenna array 254 may be disposed to form beams in the direction‘−y’, respectively. When the antenna structure 240 illustrated in FIG.2E is compared with the antenna structure 250 illustrated in FIG. 2F,the directions of the first antenna array 241 of FIG. 2E and the firstantenna array 251 of FIG. 2F may be different. For another example, thedirections of the second antenna array 242 of FIG. 2E and the secondantenna array 252 of FIG. 2F may be different. As such, the intensity ofeach of the signals radiated in the direction ‘z’ and the direction ‘−z’by the first antenna array 241 and the second antenna array 242 of FIG.2E may be somewhat stronger than the intensity of the signal radiated inthe direction ‘−y’. The intensity of each of the signals radiated in thedirection ‘−y’ by the first antenna array 251 and the second antennaarray 252 of FIG. 2F may be somewhat stronger than the intensity of eachof the signals radiated in the direction ‘z’ and the direction ‘−z’.

FIG. 3A is a sectional view illustrating an example antenna structureincluding an antenna array, according to an embodiment. FIG. 3B is adiagram illustrating an example antenna structure including an antennaarray, according to an embodiment. FIG. 3B illustrates a detailedstructural view of an antenna structure 310 illustrated in FIG. 3A.

FIG. 3C is a sectional view illustrating an example antenna structureincluding an antenna array, according to another embodiment. FIG. 3D isa diagram illustrating an example antenna structure including an antennaarray, according to still another embodiment. FIG. 3E is a sectionalview illustrating an example antenna structure including an antennaarray, according to still another embodiment.

Referring to FIG. 3A, the antenna structure 310 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a printed circuit board 311 (or a first printed circuit board),a first antenna array 312, and/or a second antenna array 313. Forexample, the first antenna array 312 or the second antenna array 313 mayinclude patch antennas or dipole antennas, respectively.

According to an embodiment, the printed circuit board 311 may have aninverted 1′ shape. In the case of FIG. 3A, the first antenna array 312may be disposed on one surface, which is capable of forming a beam inthe direction ‘−y’, of the inverted 1′ shape of the printed circuitboard 311; the second antenna array 313 may be disposed on the othersurface, which is capable of forming a beam in the direction ‘z’, of theinverted shape of the printed circuit board 311. For example, the firstantenna array 312 may transmit and/or receive a signal in the direction‘−y’. The second antenna array 313 may transmit and/or receive a signalin the direction ‘z’.

Referring to FIG. 3B, according to an embodiment, the first antennaarray 312 and the second antenna array 313 may be connected to awireless communication circuit 315 directly or indirectly. When thefirst antenna array 312 and the second antenna array 313 are directlyconnected to the wireless communication circuit 315, the first antennaarray 312 and the second antenna array 313 may be electrically connectedto the wireless communication circuit 315 via a feed line 314. Thewireless communication circuit 315 may transmit and/or receive a signalin a specified frequency band by feeding power to the first antennaarray 312 and the second antenna array 313 directly or indirectly.

According to an embodiment, the printed circuit board 311 may include afirst structure 311-1 and a second structure 311-2. The first structure311-1 and the second structure 311-2 may be manufactured as a singleprinted circuit board. For example, the printed circuit board 311 mayinclude the first structure 311-1 and the second structure 311-2 byapplying the heat of a specific temperature or more to a portion wherebending is required after the wire and the part are mounted.

Referring to FIG. 3C, an antenna structure 320 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 321, a second antenna array 322, and athird antenna array 323. For example, each of the first antenna array321, the second antenna array 322, and the third antenna array 323 mayinclude patch antennas or dipole antennas. In the case of FIG. 3C, aprinted circuit board 324 may have a shape. The first antenna array 321may be disposed on one surface, which faces in the direction ‘−y’, ofthe printed circuit board 324; the second antenna array 322 may bedisposed on one surface, which faces in the direction ‘z’, of theprinted circuit board 324; the third antenna array 323 may be disposedon one surface, which faces in the direction ‘−z’, of the printedcircuit board 324. For example, the first antenna array 321 may form abeam in the direction ‘−y’; the second antenna array 322 may form a beamin the direction ‘z’; the third antenna array 323 may form a beam in thedirection ‘−z’; the first antenna array 321, the second antenna array322, and the third antenna array 323 may transmit and/or receivesignals. Since the antenna structure 320 illustrated in FIG. 3C includesthird antenna array 323, the antenna structure 320 may transmit and/orreceive a signal in the direction ‘−z’, unlike the antenna structure 310illustrated in FIG. 3A.

Referring to FIG. 3D, an antenna structure 330 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 331, a second antenna array 332, a thirdantenna array 333, and a fourth antenna array 334. For example, each ofthe first antenna array 331, the second antenna array 332, the thirdantenna array 333, and the fourth antenna array 334 may include patchantennas or dipole antennas. In the case of FIG. 3D, the first antennaarray 331 and the second antenna array 332 may form beams in thedirection ‘−y’, and the third antenna array 333 and the fourth antennaarray 334 may form beams in the direction ‘z’. For example, the firstantenna array 331 and the second antenna array 332 may transmit and/orreceive signals in the direction ‘−y’, and the third antenna array 333and the fourth antenna array 334 may transmit and/or receive signals inthe direction ‘z’.

Referring to FIG. 3E, an antenna structure 340 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude the printed circuit board 324, a first antenna array 341, asecond antenna array 342, a third antenna array 343, a fourth antennaarray 344, a fifth antenna array 345, and a sixth antenna array 346. Forexample, each of the first antenna array 341, the second antenna array342, the third antenna array 343, the fourth antenna array 344, thefifth antenna array 345, and the sixth antenna array 346 may includepatch antennas or dipole antennas. For example, the printed circuitboard 324 may have a shape.

According to an embodiment, the first antenna array 341 and the secondantenna array 342 may form beams in the direction ‘−y’; the thirdantenna array 343 and the fourth antenna array 344 may form beams in thedirection ‘z’; the fifth antenna array 345 and the sixth antenna array346 may form beams in the direction ‘−z’. According to an embodiment,the first antenna array 341 and the second antenna array 342 maytransmit and/or receive signals in the direction ‘−y’; the third antennaarray 343 and the fourth antenna array 344 may transmit and/or receivesignals in the direction ‘z’; the fifth antenna array 345 and the sixthantenna array 346 may transmit and/or receive signals in the direction‘−z’.

FIG. 4A is a sectional view illustrating an example antenna structureincluding an antenna array, according to an embodiment. FIG. 4B is adiagram illustrating an example antenna structure including an antennaarray, according to an embodiment. FIG. 4C is a sectional viewillustrating an example antenna structure including an antenna array,according to another embodiment.

Referring to FIG. 4A, an antenna structure 410 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a printed circuit board 411 (or a first printed circuit board),a first antenna array 412, and a second antenna array 413. For example,each of the first antenna array 412 and the second antenna array 413 mayinclude dipole antennas or patch antennas. In the case of FIG. 4A, thefirst antenna array 412 and the second antenna array 413 may form beamsin the direction ‘z’ and the direction ‘−z’, respectively. For example,the first antenna array 412 and the second antenna array 413 maysubstantially transmit and/or receive signals in the direction ‘z’ andthe direction ‘−z’, respectively.

Referring to FIG. 4B, the first antenna array 412 and the second antennaarray 413 may include a plurality of dipole antennas. The plurality ofdipole antennas may be electrically connected to a wirelesscommunication circuit 415 through a feed line 414. The wirelesscommunication circuit 415 may feed power to the first antenna array 412and the second antenna array 413 through the feed line 414, and thefirst antenna array 412 and the second antenna array 413 may transmitand/or receive a signal in a specified frequency band.

Referring to FIG. 4C, the antenna structure 420 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 421 and a second antenna array 422. Forexample, each of the first antenna array 412 and the second antennaarray 413 may include dipole antennas or patch antennas. For example,the first antenna array 421 and the second antenna array 422 may formbeams in the direction ‘−y’. For example, the first antenna array 421and the second antenna array 422 may transmit and/or receive signals inthe direction ‘−y’. Unlike the antenna structure 410 illustrated in FIG.4A, in the antenna structure 420 illustrated in FIG. 4C, the intensityof a signal transmitted and received in the direction ‘−y’ may berelatively stronger than the intensity of each of signals transmittedand received in the direction ‘z’ and the direction ‘−z’, because thefirst antenna array 421 and the second antenna array 422 form beams inthe direction ‘−y’.

FIG. 5 is a sectional view illustrating an example electronic device inwhich an embossing layer is interposed between an antenna structure anda cover glass, according to an embodiment.

Referring to FIG. 5 , the electronic device 100 may include anadditional embossing layer 520 interposed between an antenna structure510 (e.g., the first antenna structure 130 f or the second antennastructure 130 s of FIG. 1 ) and the second area 111 s. The additionalembossing layer 520 may protect the antenna structure 510 by absorbingexternal impact applied to the antenna structure 510.

According to an embodiment, the antenna structure 510 may include afirst antenna array 512, a second antenna array 513, and a third antennaarray 514. For example, the first antenna array 512 may include dipoleantennas, and each of the second antenna array 513 and the third antennaarray 514 may include of patch antennas. The first antenna array 512 mayform a beam in the direction ‘−y’, and the second antenna array 513 andthe third antenna array 514 may form beams in the direction ‘z’. Forexample, the first antenna array 512 may transmit and/or receive asignal in the direction ‘−y’. The second antenna array 513 and the thirdantenna array 514 may transmit and/or receive signals in the direction‘z’.

According to an embodiment, an electronic part (e.g., a fingerprintsensor, an illuminance sensor, or a camera) may be disposed in thedirection ‘−z’ of the antenna structure 510.

FIG. 6A is a sectional view illustrating an example inverted L-shapedantenna structure, according to an embodiment. FIG. 6B is a diagramillustrating an example inverted L-shaped antenna structure, accordingto an embodiment.

FIG. 6C is a sectional view illustrating an example inverted L-shapedantenna structure, according to another embodiment. FIG. 6D is a diagramillustrating an example inverted L-shaped antenna structure, accordingto still another embodiment. FIG. 6E is a sectional view illustrating anexample inverted L-shaped antenna structure, according to yet anotherembodiment.

Referring to FIG. 6A, an antenna structure 610 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a printed circuit board 611 (or a first printed circuit board),a first antenna array 612, and/or a second antenna array 613. A part ofthe printed circuit board 611 may extend in the direction ‘y’, and theremaining parts of the printed circuit board 611 may extend in thedirection ‘−z’. The first antenna array 612 and the second antenna array613 may form beams in the direction ‘z’. For example, the first antennaarray 612 and the second antenna array 613 may transmit and/or receivesignals substantially in the direction ‘z’.

Referring to FIG. 6B, the printed circuit board 611 may include a firstprinted circuit board 611 f and a second printed circuit board 611 s.The first printed circuit board 611 f and the second printed circuitboard 611 s may be electrically connected to each other through aconnection member 614 (e.g., a flexible printed circuit board (FPCB)).

According to an embodiment, the first antenna array 612 may be disposedon the first printed circuit board 611 f. The first antenna array 612may be electrically connected to a wireless communication circuit 618through a first feed line 615. The wireless communication circuit 618may transmit and/or receive a signal in a specified frequency band byfeeding power the first antenna array 612 through the first feed line615.

According to an embodiment, a second feed line 616 may be connected to athird feed line 617, which is disposed on the second printed circuitboard 611 s, through the connection member 614. The wirelesscommunication circuit 618 may feed power directly to the second antennaarray 613 through the second feed line 616, the connection member 614,and the third feed line 617. For another example, the wirelesscommunication circuit 618 may transmit and/or receive a signal in aspecified frequency band by indirectly feeding power to the secondantenna array 613.

Referring to FIG. 6C, an antenna structure 620 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 621, a second antenna array 622, and athird antenna array 623. For example, the first antenna array 621 mayinclude dipole antennas, and the second antenna array 622 and/or thethird antenna array 623 may include patch antennas. The first antennaarray 621, the second antenna array 622, and the third antenna array 623may form beams in the direction ‘−y’. For example, the first antennaarray 621, the second antenna array 622, and the third antenna array 623may transmit and/or receive signals in the direction ‘−y’.

Referring to FIG. 6D, an antenna structure 630 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 631, a second antenna array 632, a thirdantenna array 633, and a fourth antenna array 634. For example, thefirst antenna array 631, the second antenna array 632, the third antennaarray 633, or the fourth antenna array 634 may include patch antennas ordipole antennas. The first antenna array 631 and the second antennaarray 632 may form beams in the direction ‘z’, and the third antennaarray 633 and the fourth antenna array 634 may form beams in thedirection ‘−y’. For example, the first antenna array 631 and the secondantenna array 632 may transmit and/or receive signals in the direction‘z’. The third antenna array 633 and the fourth antenna array 634 maytransmit and/or receive signals in the direction ‘−y’.

Referring to FIG. 6E, an antenna structure 640 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 641 and a second antenna array 642. Forexample, the first antenna array 641 and/or the second antenna array 642may include patch antennas or dipole antennas, respectively. The firstantenna array 641 may form a beam in the direction ‘z’, and the secondantenna array 642 may form a beam in the direction ‘−y’. For example,the first antenna array 641 may transmit and/or receive a signal in thedirection ‘z’. The second antenna array 642 may transmit and/or receivea signal in the direction ‘−y’.

FIG. 7A is a sectional view illustrating an example U-shaped antennastructure, according to an embodiment. FIG. 7B is a sectional viewillustrating an example U-shaped antenna structure, according to anotherembodiment.

Referring to FIG. 7A, an antenna structure 710 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a U-shaped printed circuit board 711 (or a first printed circuitboard), a first antenna array 712, a second antenna array 713, a thirdantenna array 714, and a fourth antenna array 715, which are disposed ona printed circuit board 711. The first antenna array 712, the secondantenna array 713, the third antenna array 714, and the fourth antennaarray 715 may form beams in the direction ‘−y’. For example, the firstantenna array 712, the second antenna array 713, the third antenna array714, and the fourth antenna array 715 may transmit and/or receivesignals in the direction ‘−y’.

Referring to FIG. 7B, an antenna structure 740 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a first antenna array 741 and a second antenna array 742. Forexample, each of the first antenna array 741 and the second antennaarray 742 may include dipole antennas or patch antennas. The firstantenna array 741 and the second antenna array 742 may form beams in thedirection ‘−y’. For example, the first antenna array 741 or the secondantenna array 742 may transmit and/or receive a signal in the direction‘−y’.

FIG. 8A is a diagram illustrating an example antenna structure includinga wireless communication circuit, according to an embodiment. FIG. 8B isa diagram illustrating an example antenna structure including twowireless communication circuits, according to an embodiment. FIG. 8C isa diagram illustrating an example antenna structure including threewireless communication circuits, according to an embodiment.

Referring to FIG. 8A, an antenna structure 810 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a printed circuit board 811 (or a first printed circuit board),a first antenna array 812, a second antenna array 813, a third antennaarray 814, and a wireless communication circuit 815. For example, thefirst antenna array 812 may include dipole antennas. The second antennaarray 813 and/or the third antenna array 814 may include patch antennas.The first antenna array 812 may form a beam in the direction ‘−y’. Thesecond antenna array 813 and the third antenna array 814 may form beamsin the direction ‘z’. The wireless communication circuit 815 may beelectrically connected to the first antenna array 812, the secondantenna array 813, and the third antenna array 814.

According to an embodiment, the wireless communication circuit 815 maytransmit and/or receive a signal in a specified frequency band byfeeding power to the first antenna array 812, the second antenna array813, and the third antenna array 814. For example, the wirelesscommunication circuit 815 may transmit and/or receive a signal in afrequency range of 3 GHz to 100 GHz by feeding power to the firstantenna array 812.

Referring to FIG. 8B, an antenna structure 820 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude an inverted L-shaped printed circuit board 821 (or a firstprinted circuit board), a first antenna array 822, a second antennaarray 823, a third antenna array 824, a first wireless communicationcircuit 825, and a second wireless communication circuit 826. Forexample, the first antenna array 822 may include dipole antennas. Thesecond antenna array 823 and/or the third antenna array 824 may includepatch antennas. The first antenna array 822, the second antenna array823, and the third antenna array 824 may form beams in the direction‘z’. The first wireless communication circuit 825 may be electricallyconnected to the first antenna array 822, and the second wirelesscommunication circuit 826 may be electrically connected to the secondantenna array 823 and the third antenna array 824.

According to an embodiment, the first wireless communication circuit 825may transmit and/or receive a signal in a specified frequency band byfeeding power to the first antenna array 822. The second wirelesscommunication circuit 826 may transmit and/or receive a signal in aspecified frequency band by feeding power to the second antenna array823 and the third antenna array 824. For example, the first wirelesscommunication circuit 825 may transmit and/or receive a signal in afrequency range of 3 GHz to 100 GHz by feeding power to the firstantenna array 822.

Referring to FIG. 8C, an antenna structure 830 (e.g., the first antennastructure 130 f or the second antenna structure 130 s of FIG. 1 ) mayinclude a U-shaped printed circuit board 831 (or a first printed circuitboard), a first antenna array 832, a second antenna array 833, a thirdantenna array 834, a first wireless communication circuit 836, a secondwireless communication circuit 837, and/or a third wirelesscommunication circuit 838. For example, each of the first antenna array832, the second antenna array 833, and the third antenna array 834 mayinclude patch antennas or dipole antennas. The first antenna array 832,the second antenna array 833, and the third antenna array 834 may formbeams in the direction ‘z’, the direction ‘−y’, and the direction ‘−z’,respectively.

According to an embodiment, the first wireless communication circuit 836may be electrically connected to the first antenna array 832, and thesecond wireless communication circuit 837 may be electrically connectedto the second antenna array 833. The third wireless communicationcircuit 838 may be electrically connected to the third antenna array834. According to an embodiment, the first wireless communicationcircuit 836 may transmit and/or receive a signal in a specifiedfrequency band by feeding power to the first antenna array 832. Thesecond wireless communication circuit 837 may transmit and/or receive asignal in a specified frequency band by feeding power to the secondantenna array 833. The third wireless communication circuit 838 maytransmit and/or receive a signal in a specified frequency band byfeeding power to the third antenna array 834. For example, the firstwireless communication circuit 836 may transmit and/or receive a signalin a frequency range of 3 GHz to 100 GHz by feeding power to the firstantenna array 832.

FIG. 9A is a sectional view illustrating an example electronic deviceincluding an electronic part interposed between an antenna structure anda display, according to an embodiment. FIG. 9B is a diagram illustratingan example antenna structure and an electronic part, according to anembodiment.

The details about the display 120 and the adhesive member 210illustrated in FIG. 2A and the additional embossing layer 520illustrated in FIG. 5 may be applied to FIG. 9A.

Referring to FIG. 9A, an antenna structure 910 f (e.g., the firstantenna structure 130 f or the second antenna structure 130 s of FIG. 1) may include an L-shaped printed circuit board 910, a first antennaarray 911, a second antenna array 912, a third antenna array 913, and awireless communication circuit 914. For example, the first antenna array911 may include dipole antennas, and the second antenna array 912 and/orthe third antenna array 913 may include patch antennas. The firstantenna array 911, the second antenna array 912, and the third antennaarray 913 may form beams in the direction ‘−y’. The wirelesscommunication circuit 914 may be electrically connected to the firstantenna array 911, the second antenna array 912, and the third antennaarray 913. The wireless communication circuit 914 may transmit and/orreceive a signal in a specified frequency band by feeding power to thefirst antenna array 911, the second antenna array 912, and the thirdantenna array 913.

According to an embodiment, the printed circuit board 910 may include afirst structure 910-1 and a second structure 910-2. The first structure910-1 may include a first surface 910-3 facing a side member (e.g., theside member 112 of FIG. 1 ) and a second surface 910-4 that faces adirection facing away from the first surface 910-3. The second structure910-2 may be bent from the first structure 910-1 and may include a thirdsurface 910-5 facing the second plate (e.g., 113 in FIG. 1 ) and afourth surface 910-6 facing the first plate (e.g., 111 in FIG. 1 ).

According to an embodiment, the L-shaped printed circuit board 910 maysubstantially surround an electronic part 920. For example, theelectronic part 920 may be, for example, and without limitation, aproximity sensor, a camera module, a receiver, an iris sensor, anilluminance sensor, or the like. For example, when the electronic part920 is a proximity sensor, the electronic part 920 may determine whetherthe user approaches the electronic device 100. According to anembodiment of the present disclosure, the electronic part 920 may bemounted between the L-shaped printed circuit board 910 and the display120.

Referring to FIG. 9B, the printed circuit board 910 may include thefirst structure 910-1 and the second structure 910-2. The firststructure 910-1 and the second structure 910-2 may be connected to eachother through a connection member 916 (e.g., FPCB).

According to an embodiment, the second antenna array 912, the thirdantenna array 913, a feed line 915, and the wireless communicationcircuit 914 may be disposed in the first structure 910-1. The wirelesscommunication circuit 914 may transmit and/or receive a signal in aspecified frequency band by feeding power to the second antenna array912 and the third antenna array 913 directly or indirectly.

According to an embodiment, a via 911 v and the electronic part 920 maybe disposed in or on the second structure 910-2. The via 911 v may beused as the first antenna array 911. For example, the wirelesscommunication circuit 914 may feed power to the via 911 v through theconnection member 916, and the wireless communication circuit 914 maytransmit and/or receive a signal in a specified frequency band throughthe via 911 v.

FIG. 10A is a sectional view illustrating an example electronic devicein which a first printed circuit board and a second printed circuitboard are connected to each other, according to an embodiment. FIG. 10Bis a sectional view illustrating an example electronic device in which afirst printed circuit board and a second printed circuit board areconnected to each other, according to another embodiment. FIG. 10C is asectional view illustrating an example electronic device in which afirst printed circuit board and a second printed circuit board areconnected to each other, according to still another embodiment.

Referring to FIG. 10A, an antenna structure 1011 f (e.g., the firstantenna structure 130 f or the second antenna structure 130 s of FIG. 1) may include a first printed circuit board 1011 p. One end of the firstprinted circuit board 1011 p may be attached to a bezel area of thecover glass 111 through the adhesive member 210, and the other end ofthe first printed circuit board 1011 p may be connected to the secondprinted circuit board 150 through a connection member 1012.

According to an embodiment, the connection member 1012 may be connectedto a surface facing the direction ‘−z’ of the second printed circuitboard 150. The processor 160 disposed on the second printed circuitboard 150 may control an antenna structure 1011 f and/or an electronicpart 1013 through the connection member 1012. For example, the processor160 may control a wireless communication circuit 1011 r to feed power toan antenna array 1011 a or may control the electronic part 1013 to emitlight in the infrared band. For example, the connection member 1012 mayinclude an FPCB.

Referring to FIG. 10B, one end of a connection member 1022 may beconnected to a first printed circuit board 1021 p, and the other end ofthe connection member 1022 may be connected to a surface facing thedirection ‘z’ of the second printed circuit board 150.

According to an embodiment, an electronic part 1023 and a wirelesscommunication circuit 1021 r may be interposed between the first printedcircuit board 1021 p and the second printed circuit board 150 in thedirection ‘y’, in parallel. The processor 160 disposed on the secondprinted circuit board 150 may control an antenna structure 1021 f (e.g.,the first antenna structure 130 f or the second antenna structure 130 sof FIG. 1 ) and/or the electronic part 1023 through the connectionmember 1022.

According to an embodiment, the antenna structure 1021 f may include afirst antenna array 1021-1, a second antenna array 1021-2, and a thirdantenna array 1021-3. The first antenna array 1021-1, the second antennaarray 1021-2, and the third antenna array 1021-3 may include patchantennas or dipole antennas.

Referring to FIG. 10C, one end of a connection member 1032 may beconnected to a first printed circuit board 1031 p, and the other end ofthe connection member 1032 may be connected to a surface facing thedirection ‘z’ of the second printed circuit board 150.

According to an embodiment, an electronic part 1033 and a wirelesscommunication circuit 1031 r may be interposed between the first printedcircuit board 1031 p and the second printed circuit board 150 in thedirection ‘z’, in parallel. The processor 160 disposed on the secondprinted circuit board 150 may control an antenna structure 1031 f (e.g.,the first antenna structure 130 f or the second antenna structure 130 sof FIG. 1 ) and/or the electronic part 1033 through the connectionmember 1032.

According to an embodiment, a signal for controlling the wirelesscommunication circuit 1031 r and electronic part 1033 may be transmittedthrough the connection member 1032. For example, the processor 160 maycontrol the wireless communication circuit 1031 r and the electronicpart 1033 through the connection member 1032.

According to an embodiment, the antenna structure 1031 f may include afirst antenna array 1031-1, a second antenna array 1031-2, and a thirdantenna array 1031-3. The first antenna array 1031-1, the second antennaarray 1031-2, and the third antenna array 1031-3 may include patchantennas or dipole antennas.

FIG. 11A is a sectional view illustrating an example I-shaped antennastructure, according to an embodiment. FIG. 11B is a sectional viewillustrating an example L-shaped antenna structure, according to anembodiment. FIG. 11C is a sectional view illustrating an exampleL-shaped antenna structure, according to another embodiment. The antennastructure illustrated in FIGS. 11A, 11B and 11C may be mounted in anelectronic device 900 illustrated in FIG. 9A.

Referring to FIG. 11A, an antenna structure 1120 (e.g., the firstantenna structure 130 f or the second antenna structure 130 s of FIG. 1) may include a printed circuit board 1120 p, a first antenna array1121, a second antenna array 1122, and a third antenna array 1123. Forexample, the printed circuit board 1120 p may be a planar shape, and thevia 1121 formed in the printed circuit board 1120 may be used as thefirst antenna array 1121. For another example, the first antenna array1121 may include dipole antennas, and the second antenna array 1122and/or the third antenna array 1123 may include patch antennas. Thefirst antenna array 1121, the second antenna array 1122, and the thirdantenna array 1123 may form beams in the direction ‘−z’. For example,the first antenna array 1121, the second antenna array 1122, and thethird antenna array 1123 may transmit and/or receive signals in thedirection ‘−z’.

Referring to FIG. 11B, an antenna structure 1130 (e.g., the firstantenna structure 130 f or the second antenna structure 130 s of FIG. 1) may include a printed circuit board 1111, a first antenna array 1131,a second antenna array 1132, a third antenna array 1133, and a fourthantenna array 1134. For example, each of the first antenna array 1131,the second antenna array 1132, the third antenna array 1133, and thefourth antenna array 1134 may include patch antennas or dipole antennas.The first antenna array 1131 and the second antenna array 1132 may formbeams in the direction ‘−y’, and the third antenna array 1133 and thefourth antenna array 1134 may form beams in the direction ‘−z’. Forexample, the first antenna array 1131 and the second antenna array 1132may transmit and/or receive signals in the direction ‘−y’, and the thirdantenna array 1133 and the fourth antenna array 1134 may transmit and/orreceive signals in the direction ‘−z’.

Referring to FIG. 11C, an antenna structure 1140 (e.g., the firstantenna structure 130 f or the second antenna structure 130 s of FIG. 1) may include the printed circuit board 1111, a first antenna array1141, and a second antenna array 1142. For example, each of the firstantenna array 1141 and the second antenna array 1142 may include patchantennas or dipole antennas. The first antenna array 1141 may form abeam in the direction ‘−y’, and the second antenna array 1142 may form abeam in the direction ‘−z’. For example, the first antenna array 1141may transmit and/or receive a signal in the direction ‘−y’. The secondantenna array 1142 may transmit and/or receive a signal in the direction‘−z’.

FIG. 12A is a diagram illustrating an example electronic device in whichan antenna structure including a plurality of electronic parts ismounted, according to an embodiment. FIG. 12B is a diagram illustratingan enlarged view of an example antenna structure, according to anembodiment. FIG. 12C is a diagram illustrating an enlarged view of anexample antenna structure, according to another embodiment. The antennastructure illustrated in FIGS. 12B and 12C illustrates the enlarged viewof an antenna structure 1230 illustrated in FIG. 12A.

Referring to FIG. 12A, an electronic device 1200 may include the display120 and the antenna structure 1230.

According to an embodiment, the display 120 may include an activationarea 1210 and a deactivation area 1220. At least one pixel may bedisposed in the activation area 1210, and various pieces of content(e.g., a photo or a video) may be output. The deactivation area 1220 maybe an area where a part of the activation area 1210 is removed, and mayhave, for example, a ‘U’ shape. The antenna structure 1230 may bedisposed in the deactivation area 1220.

Referring to FIGS. 12B and 12C, the antenna structure 1230 (e.g., thefirst antenna structure 130 f or the second antenna structure 130 s ofFIG. 1 ) may include an antenna array 1231, a wireless communicationcircuit 1232, a connection member 1233, and a plurality of electronicparts 1234, 1235, 1236, and 1237. The wireless communication circuit1232 may transmit and/or receive a signal in a specified frequency bandby feeding power to the antenna array 1231. The connection member 1233may connect the second printed circuit board 150 to the antennastructure 1230. The processor 160 disposed on the second printed circuitboard 150 may control the plurality of electronic parts 1234, 1235,1236, and 1237. For example, when the first electronic part 1234 is aproximity sensor, the second electronic part 1235 is a receiver, thethird electronic part 1236 is a camera, and when the fourth electronicpart 1237 is an illuminance sensor, the processor 160 may control thefirst electronic part 1234 to sense whether a user approaches theelectronic device 1200. The processor 160 may control the secondelectronic part 1235 so that the voice of another user is output while auser makes a call and may control the third electronic part 1236 tocapture a photo or a video in response to a user input. The processor160 may also control the fourth electronic part 1237 to measure anexternal illumination value.

According to an embodiment of the present disclosure, an electronicdevice 100 may include housing 110 including a first plate 111 includinga glass plate, a second plate 113 facing the first plate 111, and a sidemember (e.g., side face or side surface) 112 surrounding a space betweenthe first plate 111 and the second plate 113, a display 120 disposedinside the space and exposed through a first area 111 f of the firstplate 111, an antenna structure 910 f (e.g., the antenna structure 910 fof FIG. 9A) which at least partially overlaps a second area 111 s of thefirst plate 111 when viewed from above the first plate 111 and which isconnected to the second area 111 s, a printed circuit board 910 (e.g.,the printed circuit board 910 of FIG. 9A) disposed in parallel to thefirst plate 111, disposed inside the space and electrically connected tothe wireless communication circuit, and a processor 160 disposed on theprinted circuit board 910 and connected to the display 120. The antennastructure 910 f may include a first structure 910-1 including a firstsurface facing the side member 112 and a second surface facing away fromthe side member 112, a first array (e.g., the second antenna 912 of FIG.9A and the third antenna 913 of FIG. 9A) of conductive patterns formedon the first surface or between the first surface and the second surfaceand a wireless communication circuit 914 (e.g., the wirelesscommunication circuit 914 of FIG. 9A), which is attached to the antennastructure 910 f or formed on the antenna structure 910 f, which iselectrically connected to the first array, and which is configured totransmit and/or receive a signal in a frequency range of 3 GHz to 100GHz.

According to an embodiment of the present disclosure, the display 120may include an embossing layer 141 extending from the first area 111 fto at least part of the second area 111 s, and the antenna structure 910f may be connected to the embossing layer 141.

According to an embodiment of the present disclosure, the antennastructure 910 f may be attached to the embossing layer 141 through anadhesive layer 210.

According to an embodiment of the present disclosure, the display 120may include an organic light emitting diode layer interposed between theembossing layer 141 and the first plate 111, a conductive layer 143interposed between the embossing layer 141 and the printed circuit board910, and a heat insulating layer 144 interposed between the conductivelayer 143 and the printed circuit board 910.

According to an embodiment of the present disclosure, the wirelesscommunication circuit 914 may be attached to the second surface or isformed on the second surface.

According to an embodiment of the present disclosure, the antennastructure 910 f may include a third surface facing the second plate 113and a fourth surface facing the first plate 111, and the antennastructure 910 f may further include a second structure 910-2 bent fromthe first structure.

According to an embodiment of the present disclosure, the wirelesscommunication circuit 914 may be attached to the fourth surface or isformed on the fourth surface.

According to an embodiment of the present disclosure, the antennastructure 910 f may further include a second array (e.g., the firstantenna array 911 of FIG. 9A) of conductive patterns formed on the thirdsurface or formed between the third surface and the fourth surface, andthe wireless communication circuit 914 may be electrically connected tothe second array 911.

According to an embodiment of the present disclosure, the electronicdevice 100 may further include an electronic element (e.g., theelectronic part 920 of FIG. 9A) attached to the antenna structure 910 f.The electronic element may include at least one of a camera, a speaker,a light emitting diode, an infrared sensor, a microphone, or a proximitysensor.

According to an embodiment of the present disclosure, the electronicdevice 100 may further include a flexible member (e.g., the connectionmember 1012 of FIG. 10A) electrically connecting the display 120 to theprinted circuit board 910. The flexible member 1012 may at least partlyoverlap with a third area of the first plate 111 when viewed from abovethe first plate 111, and the first area 111 f may be positioned betweenthe second area 111 s and the third area.

According to an embodiment of the present disclosure, an electronicdevice 100 may include housing 110 including a first plate 111 includinga first area 111 f and a second area 111 s surrounding the first area111 f, a second plate 113 facing the first plate 111, a side member 112surrounding a space between the first plate 111 and the second plate113, a display 120 positioned inside the space and exposed through thefirst area 111 f, an antenna structure 220 disposed at a locationcorresponding to the second area 111 s in the space, and a processor 160disposed on the second printed circuit board 150 and electricallyconnected to the wireless communication circuit 226. The antennastructure 220 may include a first printed circuit board 221 attached tothe second area 111 s, a first antenna array 222 disposed in an areaadjacent to the second area 111 s in the first printed circuit board221, and a wireless communication circuit 226 configured to transmit andreceive a signal in a specified frequency band by feeding power to thefirst antenna array 222, and a second printed circuit board 150interposed between the display 120 and the second plate.

According to an embodiment of the present disclosure, the antennastructure 220 may further include a second antenna array 223 disposed inan area adjacent to the side member 112 in the first printed circuitboard 221.

According to an embodiment of the present disclosure, wherein each ofthe first antenna array 222 and second antenna array 223 may include atleast one of a patch antenna array and a dipole antenna array.

According to an embodiment of the present disclosure, the antennastructure 220 may further include a third antenna array (e.g., thesecond antenna array 242 of FIG. 2E) disposed in an area adjacent to thesecond plate 113 in the first printed circuit board 221.

According to an embodiment of the present disclosure, the wirelesscommunication circuit 226 may transmit and/or receive the signal in adirection in which the second area 111 s is positioned with respect tothe first antenna array 222.

According to an embodiment of the present disclosure, the wirelesscommunication circuit 226 may transmit and/or receive the signal in adirection in which the side member 112 is positioned with respect to thefirst antenna array 222.

According to an embodiment of the present disclosure, the electronicdevice 100 may further include a shield layer 140 interposed between thedisplay 120 and the second printed circuit board 150 and configured toshield electro-magnetic interference (EMI) between the display 120 andthe second printed circuit board 150.

According to an embodiment of the present disclosure, at least one of aproximity sensor, an illuminance sensor, a camera, and a receiver may beinterposed between the antenna structure 220 and the shield layer 140.

According to an embodiment of the present disclosure, the electronicdevice 100 may further include a connection member (e.g., the connectionmember 1012 of FIG. 10A) electrically connecting the first printedcircuit board 221 to the second printed circuit board 150.

According to an embodiment of the present disclosure, the second area111 s may correspond to a bezel of the electronic device 100.

FIG. 13 is a block diagram illustrating an example electronic device ina network environment according to various embodiments.

Referring to FIG. 13 , an electronic device 1301 may communicate with anelectronic device 1302 through a first network 1398 (e.g., a short-rangewireless communication) or may communicate with an electronic device1304 or a server 1308 through a second network 1399 (e.g., along-distance wireless communication) in a network environment 1300.According to an embodiment, the electronic device 1301 may communicatewith the electronic device 1304 through the server 1308. According to anembodiment, the electronic device 1301 may include a processor 1320, amemory 1330, an input device 1350, a sound output device 1355, a displaydevice 1360, an audio module 1370, a sensor module 1376, an interface1377, a haptic module 1379, a camera module 1380, a power managementmodule 1388, a battery 1389, a communication module 1390, a subscriberidentification module 1396, and an antenna module 1397. According tosome embodiments, at least one (e.g., the display device 1360 or thecamera module 1380) among components of the electronic device 1301 maybe omitted or other components may be added to the electronic device1301. According to some embodiments, some components may be integratedand implemented as in the case of the sensor module 1376 (e.g., afingerprint sensor, an iris sensor, or an illuminance sensor) embeddedin the display device 1360 (e.g., a display).

The processor 1320 may operate, for example, software (e.g., a program1340) to control at least one of other components (e.g., a hardware orsoftware component) of the electronic device 1301 connected to theprocessor 1320 and may process and compute a variety of data. Theprocessor 1320 may load a command set or data, which is received fromother components (e.g., the sensor module 1376 or the communicationmodule 1390), into a volatile memory 1332, may process the loadedcommand or data, and may store result data into a nonvolatile memory1334. According to an embodiment, the processor 1320 may include a mainprocessor 1321 (e.g., a central processing unit or an applicationprocessor) and an auxiliary processor 1323 (e.g., a graphic processingdevice, an image signal processor, a sensor hub processor, or acommunication processor), which operates independently from the mainprocessor 1321, additionally or alternatively uses less power than themain processor 1321, or is specified to a designated function. In thiscase, the auxiliary processor 1323 may operate separately from the mainprocessor 1321 or embedded.

In this case, the auxiliary processor 1323 may control, for example, atleast some of functions or states associated with at least one component(e.g., the display device 1360, the sensor module 1376, or thecommunication module 1390) among the components of the electronic device1301 instead of the main processor 1321 while the main processor 1321 isin an inactive (e.g., sleep) state or together with the main processor1321 while the main processor 1321 is in an active (e.g., an applicationexecution) state. According to an embodiment, the auxiliary processor1323 (e.g., the image signal processor or the communication processor)may be implemented as a part of another component (e.g., the cameramodule 1380 or the communication module 1390) that is functionallyrelated to the auxiliary processor 1323. The memory 1330 may store avariety of data used by at least one component (e.g., the processor 1320or the sensor module 1376) of the electronic device 1301, for example,software (e.g., the program 1340) and input data or output data withrespect to commands associated with the software. The memory 1330 mayinclude the volatile memory 1332 or the nonvolatile memory 1334.

The program 1340 may be stored in the memory 1330 as software and mayinclude, for example, an operating system 1342, a middleware 1344, or anapplication 1346.

The input device 1350 may be a device for receiving a command or data,which is used for a component (e.g., the processor 1320) of theelectronic device 1301, from an outside (e.g., a user) of the electronicdevice 1301 and may include, for example, a microphone, a mouse, or akeyboard.

The sound output device 1355 may be a device for outputting a soundsignal to the outside of the electronic device 1301 and may include, forexample, a speaker used for general purposes, such as multimedia play orrecordings play, and a receiver used only for receiving calls. Accordingto an embodiment, the receiver and the speaker may be either integrallyor separately implemented.

The display device 1360 may be a device for visually presentinginformation to the user of the electronic device 1301 and may include,for example, a display, a hologram device, or a projector and a controlcircuit for controlling a corresponding device. According to anembodiment, the display device 1360 may include a touch circuitry or apressure sensor for measuring an intensity of pressure on the touch.

The audio module 1370 may convert a sound and an electrical signal indual directions. According to an embodiment, the audio module 1370 mayobtain the sound through the input device 1350 or may output the soundthrough an external electronic device (e.g., the electronic device 1302(e.g., a speaker or a headphone)) wired or wirelessly connected to thesound output device 1355 or the electronic device 1301.

The sensor module 1376 may generate an electrical signal or a data valuecorresponding to an operating state (e.g., power or temperature) insideor an environmental state outside the electronic device 1301. The sensormodule 1376 may include, for example, a gesture sensor, a gyro sensor, abarometric pressure sensor, a magnetic sensor, an acceleration sensor, agrip sensor, a proximity sensor, a color sensor, an infrared sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 1377 may support a designated protocol wired or wirelesslyconnected to the external electronic device (e.g., the electronic device1302). According to an embodiment, the interface 1377 may include, forexample, an HDMI (high-definition multimedia interface), a USB(universal serial bus) interface, an SD card interface, or an audiointerface.

A connecting terminal 1378 may include a connector that physicallyconnects the electronic device 1301 to the external electronic device(e.g., the electronic device 1302), for example, an HDMI connector, aUSB connector, an SD card connector, or an audio connector (e.g., aheadphone connector).

The haptic module 1379 may convert an electrical signal to a mechanicalstimulation (e.g., vibration or movement) or an electrical stimulationperceived by the user through tactile or kinesthetic sensations. Thehaptic module 1379 may include, for example, a motor, a piezoelectricelement, or an electric stimulator.

The camera module 1380 may shoot a still image or a video image.According to an embodiment, the camera module 1380 may include, forexample, at least one lens, an image sensor, an image signal processor,or a flash.

The power management module 1388 may be a module for managing powersupplied to the electronic device 1301 and may serve as at least a partof a power management integrated circuit (PMIC).

The battery 1389 may be a device for supplying power to at least onecomponent of the electronic device 1301 and may include, for example, anon-rechargeable (primary) battery, a rechargeable (secondary) battery,or a fuel cell.

The communication module 1390 may establish a wired or wirelesscommunication channel between the electronic device 1301 and theexternal electronic device (e.g., the electronic device 1302, theelectronic device 1304, or the server 1308) and support communicationexecution through the established communication channel. Thecommunication module 1390 may include at least one communicationprocessor operating independently from the processor 1320 (e.g., theapplication processor) and supporting the wired communication or thewireless communication. According to an embodiment, the communicationmodule 1390 may include a wireless communication module 1392 (e.g., acellular communication module, a short-range wireless communicationmodule, or a GNSS (global navigation satellite system) communicationmodule) or a wired communication module 1394 (e.g., an LAN (local areanetwork) communication module or a power line communication module) andmay communicate with the external electronic device using acorresponding communication module among them through the first network1398 (e.g., the short-range communication network such as a Bluetooth, aWiFi direct, or an IrDA (infrared data association)) or the secondnetwork 1399 (e.g., the long-distance wireless communication networksuch as a cellular network, an internet, or a computer network (e.g.,LAN or WAN)). The above-mentioned various communication modules 1390 maybe implemented into one chip or into separate chips, respectively.

According to an embodiment, the wireless communication module 1392 mayidentify and authenticate the electronic device 1301 using userinformation stored in the subscriber identification module 1396 in thecommunication network.

The antenna module 1397 may include one or more antennas to transmitand/or receive the signal or power to or from an external source.According to an embodiment, the communication module 1390 (e.g., thewireless communication module 1392) may transmit and/or receive thesignal to or from the external electronic device through the antennasuitable for the communication method.

Some components among the components may be connected to each otherthrough a communication method (e.g., a bus, a GPIO (general purposeinput/output), an SPI (serial peripheral interface), or an MIPI (mobileindustry processor interface)) used between peripheral devices toexchange signals (e.g., a command or data) with each other.

According to an embodiment, the command or data may be transmitted orreceived between the electronic device 1301 and the external electronicdevice 1304 through the server 1308 connected to the second network1399. Each of the electronic devices 1302 and 1304 may be the same ordifferent types as or from the electronic device 1301. According to anembodiment, all or some of the operations performed by the electronicdevice 1301 may be performed by another electronic device or a pluralityof external electronic devices. When the electronic device 1301 performssome functions or services automatically or by request, the electronicdevice 1301 may request the external electronic device to perform atleast some of the functions related to the functions or services, inaddition to or instead of performing the functions or services byitself. The external electronic device receiving the request may carryout the requested function or the additional function and transmit theresult to the electronic device 1301. The electronic device 1301 mayprovide the requested functions or services based on the received resultas is or after additionally processing the received result. To this end,for example, a cloud computing, distributed computing, or client-servercomputing technology may be used.

The electronic device according to various embodiments disclosed in thepresent disclosure may be various types of devices. The electronicdevice may include, for example, at least one of a portablecommunication device (e.g., a smartphone), a computer device, a portablemultimedia device, a mobile medical appliance, a camera, a wearabledevice, or a home appliance. The electronic device according to anembodiment of the present disclosure should not be limited to theabove-mentioned devices.

It should be understood that various embodiments of the presentdisclosure and terms used in the embodiments do not intend to limittechnologies disclosed in the present disclosure to the particular formsdisclosed herein; rather, the present disclosure should be construed tocover various modifications, equivalents, and/or alternatives ofembodiments of the present disclosure. With regard to description ofdrawings, similar components may be assigned with similar referencenumerals. As used herein, singular forms may include plural forms aswell unless the context clearly indicates otherwise. In the presentdisclosure disclosed herein, the expressions “A or B”, “at least one ofA or/and B”, “A, B, or C” or “one or more of A, B, or/and C”, and thelike used herein may include any and all combinations of one or more ofthe associated listed items. The expressions “a first”, “a second”, “thefirst”, or “the second”, used in herein, may refer to various componentsregardless of the order and/or the importance, but do not limit thecorresponding components. The above expressions are used merely for thepurpose of distinguishing a component from the other components. Itshould be understood that when a component (e.g., a first component) isreferred to as being (operatively or communicatively) “connected,” or“coupled,” to another component (e.g., a second component), it may bedirectly connected or coupled directly to the other component or anyother component (e.g., a third component) may be interposed betweenthem.

The term “module” used herein may represent, for example, a unitincluding one or more combinations of hardware, software and firmware.The term “module” may be interchangeably used with the terms “logic”,“logical block”, “part” and “circuit”. The “module” may be a minimumunit of an integrated part or may be a part thereof. The “module” may bea minimum unit for performing one or more functions or a part thereof.For example, the “module” may include an application-specific integratedcircuit (ASIC).

Various embodiments of the present disclosure may be implemented bysoftware (e.g., the program 1340) including an instruction stored in amachine-readable storage media (e.g., an internal memory 1336 or anexternal memory 1338) readable by a machine (e.g., a computer). Themachine may be a device that calls the instruction from themachine-readable storage media and operates depending on the calledinstruction and may include the electronic device (e.g., the electronicdevice 1301). When the instruction is executed by the processor (e.g.,the processor 1320), the processor may perform a function correspondingto the instruction directly or using other components under the controlof the processor. The instruction may include a code generated orexecuted by a compiler or an interpreter. The machine-readable storagemedia may be provided in the form of non-transitory storage media. Here,the term “non-transitory”, as used herein, is a limitation of the mediumitself (i.e., tangible, not a signal) as opposed to a limitation on datastorage persistency.

According to an embodiment, the method according to various embodimentsdisclosed in the present disclosure may be provided as a part of acomputer program product. The computer program product may be tradedbetween a seller and a buyer as a product. The computer program productmay be distributed in the form of machine-readable storage medium (e.g.,a compact disc read only memory (CD-ROM)) or may be distributed onlythrough an application store (e.g., a Play Store™). In the case ofonline distribution, at least a portion of the computer program productmay be temporarily stored or generated in a storage medium such as amemory of a manufacturer's server, an application store's server, or arelay server.

Each component (e.g., the module or the program) according to variousembodiments may include at least one of the above components, and aportion of the above sub-components may be omitted, or additional othersub-components may be further included. Alternatively or additionally,some components (e.g., the module or the program) may be integrated inone component and may perform the same or similar functions performed byeach corresponding components prior to the integration. Operationsperformed by a module, a programming, or other components according tovarious embodiments of the present disclosure may be executedsequentially, in parallel, repeatedly, or in a heuristic method. Also,at least some operations may be executed in different sequences,omitted, or other operations may be added.

While the present disclosure has been shown and described with referenceto various embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the present disclosure asdefined by the appended claims and their equivalents.

FIG. 14 is a diagram illustrating an example of an electronic device1400 supporting 5G communication.

Referring to FIG. 14 , the electronic device 1400 may include a housing1410, a processor 1440, a communication module 1450 (e.g., thecommunication module 1390 of FIG. 13 ), a first communication device1421, a second communication device 1422, a third communication device1423, a fourth communication device 1424, a first conductive line 1431,a second conductive line 1432, a third conductive line 1433, or a fourthconductive line 1434.

According to an embodiment, the housing 1410 may protect any othercomponents of the electronic device 1400. The housing 1410 may include,for example, a front plate, a back plate facing away from the frontplate, and a side member (or a metal frame) surrounding a space betweenthe front plate and the back plate. The side member may be attached tothe back plate or may be integrally formed with the back plate.

According to an embodiment, the electronic device 1400 may include atleast one communication device. For example, the electronic device 1400may include the first communication device 1421, the secondcommunication device 1422, the third communication device 1423, or thefourth communication device 1424.

According to an embodiment, the first communication device 1421, thesecond communication device 1422, the third communication device 1423,or the fourth communication device 1424 may be positioned within thehousing 1410. According to an embodiment, when viewed from above thefront plate of the electronic device 1400, the first communicationdevice 1421 may be positioned at an upper left end of the electronicdevice 1400, the second communication device 1422 may be positioned atan upper right end of the electronic device 1400, the thirdcommunication device 1423 may be positioned at a lower left end of theelectronic device 1400, and the fourth communication device 1424 may bepositioned at a lower right end of the electronic device 1400.

According to an embodiment, the processor 1440 may include one or moreof a central processing unit, an application processor, a graphicprocessing unit (GPU), an image signal processor of a camera, or abaseband processor (or a communication processor (CP)). According to anembodiment, the processor 1440 may be implemented with a system on chip(SoC) or a system in package (SiP).

According to an embodiment, the communication module 1450 may beelectrically connected with at least one communication device by usingat least one conductive line. For example, the communication module 1450may be electrically connected with the first communication device 1421,the second communication device 1422, the third communication device1423, or the fourth communication device 1424 by using the firstconductive line 1431, the second conductive line 1432, the thirdconductive line 1433, or the fourth conductive line 1434. Thecommunication module 1450 may include a baseband processor, an RFIC, oran IFIC. The communication module 1450 may include a baseband processorwhich is independent of the processor 1440 (e.g., an applicationprocessor (AP)). The first conductive line 1431, the second conductiveline 1432, the third conductive line 1433, or the fourth conductive line1434 may include, for example, a coaxial cable or an FPCB.

According to an embodiment, the communication module 1450 may include afirst baseband processor (BP) (not illustrated) or a second basebandprocessor (not illustrated). The electronic device 1400 may furtherinclude one or more interfaces for supporting inter-chip communicationbetween the first BP (or the second BP) and the processor 1440. Theprocessor 1440 and the first BP or the second BP may transmit/receivedata by using the inter-chip interface (e.g., an inter processorcommunication channel).

According to an embodiment, the first BP or the second BP may provide aninterface for performing communication with any other entities. Thefirst BP may support, for example, wireless communication with regard toa first network (not illustrated). The second BP may support, forexample, wireless communication with regard to a second network (notillustrated).

According to an embodiment, the first BP or the second BP may form onemodule with the processor 1440. For example, the first BP or the secondBP may be integrally formed with the processor 1440. For anotherexample, the first BP or the second BP may be positioned within one chipor may be implemented in the form of an independent chip. According toan embodiment, the processor 1440 and at least one baseband processor(e.g., the first BP) may be integrally formed within one chip (a SoC),and another baseband processor (e.g., the second BP) may be implementedin the form of an independent chip.

According to an embodiment, the first network (not illustrated) or thesecond network (not illustrated) may correspond to the network 899 ofFIG. 8 . According to an embodiment, the first network (not illustrated)and the second network (not illustrated) may include a 4G network and a5G network, respectively. The 4G network may support, for example, along term evolution (LTE) protocol defined in the 3GPP. The 5G networkmay support, for example, a new radio (NR) protocol defined in the 3GPP.

FIG. 15 is a block diagram illustrating an example of a communicationdevice 1500.

Referring to FIG. 15 , the communication device 1500 may include acommunication circuit 1530 (e.g., an RFIC), a PCB 1550, and at least oneantenna array (e.g., a first antenna array 1540 or a second antennaarray 1545).

According to an embodiment, a communication circuit or at least oneantenna array may be positioned on or in the PCB 1550. For example, thefirst antenna array 1540 or the second antenna array 1545 may bepositioned on a first surface of the PCB 1550, and the RFIC 1530 may bepositioned on a second surface of the PCB 1550. The PCB 1550 may includea coaxial cable connector or a board to board (B-to-B) connector forelectrical connection with any other PCB (e.g., a PCB on which thecommunication module 1450 of FIG. 14 is positioned) by using atransmission line (e.g., the first conductive line 1431 of FIG. 14 or acoaxial cable). The PCB 1550 may be connected with the PCB, on which thecommunication module 1450 is positioned, for example, by using a coaxialcable, and the coaxial cable may be used to transmit a receive/transmitIF or RF signal. For another example, a power or any other controlsignal may be provided through the B-to-B connector.

According to an embodiment, the first antenna array 1540 or the secondantenna array 1545 may include a plurality of antenna elements. Theplurality of antenna elements may include a patch antenna or a dipoleantenna. For example, an antenna element included in the first antennaarray 1540 may be a patch antenna for forming a beam toward a back plateof the electronic device 1400. For another example, an antenna elementincluded in the second antenna array 1545 may be a dipole antenna forforming a beam toward a side member of the electronic device 1400.

According to an embodiment, the communication circuit 1530 may support afrequency band ranging from 24 GHz to 30 GHz or ranging from 37 GHz to40 GHz. According to an embodiment, the communication circuit 1530 mayup-convert or down-convert a frequency. For example, a communicationcircuit included in the first communication device 1421 may up-convertan IF signal received from the communication module 1450 through thefirst conductive line 1431. For another example, the communicationcircuit may down-convert a millimeter wave signal received through thefirst antenna array 1540 or the second antenna array 1545 included inthe first communication device 1421 and may transmit the down-convertedsignal to the communication module 1450.

While the present disclosure has been illustrated and described withreference to various example embodiments thereof, it will be understoodby those skilled in the art that various changes in form and details maybe made therein without departing from the spirit and scope of thepresent disclosure as defined, for example, by the appended claims andtheir equivalents.

What is claimed is:
 1. A portable communication device comprising: ahousing including a front plate, a back plate, and a side member, thefront plate including a display area and a bezel area; a displayaccommodated in the housing and visually exposed through the displayarea; a component including circuitry located at least partially under aportion of the bezel area of the front plate; a first antenna arrayincluding a plurality of antennas and located under the portion of thebezel area of the front plate such that a first signal from the firstantenna array is to be at least partially radiated toward the bezel areaas a directional beam; a second antenna array accommodated in thehousing such that a second signal from the second antenna array is to beat least partially radiated toward the back plate; a third antenna arrayaccommodated in the housing such that a third signal from the thirdantenna array is to be at least partially radiated toward the sidemember; a wireless communication circuit electrically connected to thefirst antenna array and the second antenna array and configured totransmit and/or receive a signal in a frequency range of 3 GHz to 100GHz; and a feed line made of flexible printed circuit board (PCB) andconfigured to connect the first antenna array with the wirelesscommunication circuit, wherein the component and the first antenna arrayare laterally surrounded by the display area on three sides, wherein thefirst antenna array is spaced apart from the front plate, and whenlooked from above the front plate, the feed line is disposed to at leastpartially pass under the portion of the bezel area.
 2. The portablecommunication device of claim 1, wherein the display includes anembossing layer extending from the display area to at least part of thebezel area, and wherein the first antenna array is connected to theembossing layer.
 3. The portable communication device of claim 2,wherein the first antenna array is attached to the embossing layer by anadhesive layer.
 4. The portable communication device of claim 2, whereinthe display includes: an organic light emitting diode layer interposedbetween the embossing layer and the front plate; a conductive layerinterposed between the embossing layer and a printed circuit boarddisposed inside the housing; and a heat insulating layer interposedbetween the conductive layer and the printed circuit board.
 5. Theportable communication device of claim 1, wherein the wirelesscommunication circuit is attached to a second surface facing away fromthe side member, or is formed on the second surface.
 6. The portablecommunication device of claim 1, further comprising: a printed circuitboard disposed in parallel to the front plate and electrically connectedto the wireless communication circuit; and a processor disposed on theprinted circuit board and connected to the display.
 7. The portablecommunication device of claim 6, wherein the wireless communicationcircuit is attached to a surface of the printed circuit board or isformed on the surface.
 8. The portable communication device of claim 6,wherein the wireless communication circuit is electrically connected tothe third antenna array.
 9. The portable communication device of claim1, wherein the component includes: at least one of: a camera, a speaker,a receiver, a light emitting diode, an image sensor, an infrared sensor,a microphone, a fingerprint sensor, an illuminance sensor, and aproximity sensor.
 10. The portable communication device of claim 1,further comprising: a printed circuit board disposed in parallel to thefront plate and electrically connected to the wireless communicationcircuit; and a flexible member comprising a conductive materialelectrically connecting the display to the printed circuit board,wherein the flexible member at least partially overlaps the bezel areawhen viewed from above the front plate.
 11. The portable communicationdevice of claim 1, wherein the first antenna array does not overlap thedisplay as viewed from above.
 12. The portable communication device ofclaim 1, wherein the bezel area has a notch shape surrounded by thedisplay area and the side member.
 13. The portable communication deviceof claim 1, wherein the first antenna array and the second antenna arrayare connected via a flexible printed circuit board.
 14. The portablecommunication device of claim 1, wherein the wireless communicationcircuit is a radio frequency integrated circuit (RFIC) configured totransmit a millimeter wave band signal to a corresponding one of thefirst antenna array and the second antenna array.
 15. The portablecommunication device of claim 1, wherein the wireless communicationcircuit is at least partially located under the bezel area of the frontplate.
 16. The portable communication device of claim 1, wherein a firstcircuit board including the first antenna array and a second circuitboard including the second antenna array are connected via a flexibleprinted circuit board.
 17. A portable communication device comprising: ahousing including a front cover; a display accommodated in the housingand visually exposed through a display area corresponding to the frontcover; a speaker located at least partially under a bezel areacorresponding to the front cover; a first antenna array including aplurality of antennas and located under the bezel area corresponding tothe front cover such that signals from the first antenna array are to beradiated in a direction through the front cover of the housing as adirectional beam; a wireless communication circuit; and a flexibleprinted circuit board (PCB) including a plurality of feed linesconfigured to connect the first antenna array with the wirelesscommunication circuit, wherein the speaker and the first antenna arrayare laterally surrounded by the display area on three sides, wherein atleast part of the speaker, the antennas of the first antenna array andat least a portion of the feed lines are located under a portion of thebezel area, and wherein the portion is located between a top edge of theportable communication device and a top edge of the display area. 18.The portable communication device of claim 17, wherein the plurality ofantennas of the first antenna array are configured to transmit signalsin a frequency range of 3 GHz to 100 GHz.
 19. The portable communicationdevice of claim 17, further comprising: a second antenna arrayaccommodated in the housing such that signals from the second antennaarray are to be radiated in a direction toward a rear cover of thehousing; wherein the wireless communication circuit connects the firstantenna array and the second antenna array.
 20. The portablecommunication device of claim 17, wherein the first antenna array isspaced apart from the front cover.
 21. A portable communication devicecomprising: a device enclosure having exterior surfaces of the portablecommunication device; a display viewable through a display area of afront surface of the exterior surfaces, wherein the front surfaceincludes the display area and a bezel area surrounding the display area;a speaker located behind a portion of the bezel area of the frontsurface, wherein the portion of the bezel area is disposed adjacent atop portion of the portable communication device and the portion of thebezel area; a first antenna array including a plurality of antennas andlocated behind the portion of the bezel area such that radio signalsfrom the plurality of antennas are to be radiated as a directional beamthrough the portion of the bezel area of the front surface; a wirelesscommunication circuit; and a flexible printed circuit board (PCB) toconnect the plurality of antennas of the first antenna array with thewireless communication circuit using a plurality of feed electrodes,wherein the component and the first antenna array are laterallysurrounded by the display area on three sides, and wherein the speaker,the antennas of the first antenna array, the feed electrodes and aportion of the flexible PCB are located behind the portion of the bezelarea.
 22. The portable communication device of claim 21, wherein theflexible PCB transmits the radio signals in a frequency range of 3 GHzto 100 GHz.
 23. The portable communication device of claim 21, furthercomprising: a second antenna array accommodated in the device enclosuresuch that signals from the second antenna array are to be radiatedthrough the device enclosure except the front cover; wherein thewireless communication circuit connects to the first antenna array andthe second antenna array.
 24. The portable communication device of claim21, wherein the first antenna array is spaced apart from the frontsurface.
 25. The portable communication device of claim 21, wherein thebezel area includes a notch area located between the top edge of theportable communication device and the top edge of the display area ofthe front surface, the first antenna array is located behind a firstportion of the notch area, the speaker is located behind a secondportion of the notch area, and the second portion of the notch area islocated closer to the top edge of the display area than the firstportion of the notch area.
 26. The portable communication device ofclaim 21, wherein the bezel area includes a notch area located betweenthe top edge of the portable communication device and the top edge ofthe display area of the front surface, the first antenna array islocated behind a first portion of the notch area, an image sensor,accommodated in the device enclosure, is located behind a second portionof the notch area, and the second portion of the notch area is locatedcloser to the top edge of the display area than the first portion of thenotch area.
 27. The portable communication device of claim 23, whereinthe second antenna array includes patch antennas.
 28. The portablecommunication device of claim 23, further comprising a third antennaarray accommodated in the device enclosure and connected to the wirelesscommunication circuit.
 29. The portable communication device of claim28, wherein the third antenna array includes patch antennas.
 30. Theportable communication device of any of claim 28, wherein the wirelesscommunication circuit is configured to transmit a signal in a specifiedfrequency band by feeding power to at least one of the first antennaarray, the second antenna array, and the third antenna array.